FORMING METHOD FOR THROUGH HOLE AND SUBSTRATE FORMED WITH THE THROUGH HOLE

摘要

PROBLEM TO BE SOLVED: To provide a through hole forming method which can easily form even a through hole with a large aspect ratio (thickness of substrate/diameter of through hole). SOLUTION: A hole is bored in a glass substrate with a drill and chamfered with a polishing drill (Fig. 2 (a) to (c)). Then a conductor is supplied by a conductor supplier 206 and cut to previously calculated length (length long enough to fill the through hole with the conductor) (Fig. 2 (d) to (e)). The cut conductor is compressed from above and below into a rivet shape (Fig. 2 (f)).