| 摘要 |
The present invention relates (with reference to <cross-reference target="DRAWINGS">FIG. 1</cross-reference>a) to a method of manufacture of an integrated camera and illumination device. The method comprises assembling together an optical sensor (12), illumination means (17) and associated electronic circuitry (10) into an assembled unit; placing the assembled unit into a mold; introducing an encapsulant in liquid state into the mold to surround the components therein; and the encapsulant solidifying to form an encapsulated assembly of optical sensor, illumination means and associated electronic circuitry. |
