| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device having improved adhesive force between a resin composition for sealing use and a preplating frame of particularly Pd, Pd-Au or the like and improved reflowproofness, and prevented from moistureproofness deterioration after reflow. SOLUTION: The objective resin composition for sealing use essentially comprises (A) 50-95 wt.% of an inorganic filler <=200μm in the maximum particle size and 1-60μm in mean particle size, (B) a thermosetting resin, (C) 0.001-0.5 wt.% of 4,4-dithiodimorpholine, (D) 0.01-5 wt.% of a butadiene rubber. The other objective semiconductor device where semiconductor chips are sealed with the cured product of the above resin composition is provided. |
