发明名称 METAL VAPOR DEPOSITION APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a metal vapor deposition apparatus which can improve operation efficiency, and greatly shorten an operation time. SOLUTION: This metal vapor deposition apparatus comprises an evaporation part 1 for sequentially evaporating a metallic wire rod 5 of a predetermined dimension in a case C of a vacuum state, and a supplying part 2 for sequentially supplying the metallic wire rod 5 to the evaporation part 1, while forming the metallic wire rod 5 by cutting a wire-shaped raw material 6 into the predetermined dimension in the case C of the vacuum state.
申请公布号 JP2003073811(A) 申请公布日期 2003.03.12
申请号 JP20010260063 申请日期 2001.08.29
申请人 FUJI DAIICHI SEISAKUSHO:KK 发明人 ISHIDA HIDEMI
分类号 C23C14/24;(IPC1-7):C23C14/24 主分类号 C23C14/24
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