发明名称 SHIELD TYPE PLATING HOLDER
摘要 PROBLEM TO BE SOLVED: To provide a shield type plating holder which can uniformize distribution of plating thickness on each streak, when plating a substrate even having one or more streaks to be plated. SOLUTION: This shield type plating holder is characterized by arranging several electrical conductive zones across an opening, in a support sheet made from an insulating material having an opening in the central part, to make the electrical conductive zones function as a cathode; preferably forming to a groove in the support sheet and arranging the electrical conductive zones in the bottom part of the groove, when arranging the electrical conductive zones in the support sheet; and when using it, arranging a shield between the substrate and the anode, while adjusting the position of the above electrical conductive zones according to a region to which current is easily concentrated on the surface to be plated, namely, the position to be thickly plated.
申请公布号 JP2003073896(A) 申请公布日期 2003.03.12
申请号 JP20010265686 申请日期 2001.09.03
申请人 SUMITOMO METAL MINING CO LTD 发明人 SHIMOJI TAKUMI
分类号 C25D17/10;(IPC1-7):C25D17/10 主分类号 C25D17/10
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