摘要 |
PROBLEM TO BE SOLVED: To provide a shield type plating holder which can uniformize distribution of plating thickness on each streak, when plating a substrate even having one or more streaks to be plated. SOLUTION: This shield type plating holder is characterized by arranging several electrical conductive zones across an opening, in a support sheet made from an insulating material having an opening in the central part, to make the electrical conductive zones function as a cathode; preferably forming to a groove in the support sheet and arranging the electrical conductive zones in the bottom part of the groove, when arranging the electrical conductive zones in the support sheet; and when using it, arranging a shield between the substrate and the anode, while adjusting the position of the above electrical conductive zones according to a region to which current is easily concentrated on the surface to be plated, namely, the position to be thickly plated.
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