COOLING SYSTEM FOR ELECTRONIC APPARATUS USING PIEZO-PUMP

摘要

PROBLEM TO BE SOLVED: To enhance cooling capacity of a system having an excessively large load applied on one piezo-pump, and provide an integrated structure of two piezo-pumps connected in series. SOLUTION: A cooling system cools electronic apparatuses by connecting components including pumps 1 and 7, a heat absorbing part 2 and a heat radiating part 3 with pipes 5 and 6 in series and circulating a liquid. Two piezo-pumps are used as the pumps. The heat absorbing part 2 and the heat radiating part 3 are disposed on the route between the first pump 1 and the second pump 7. The cooling system makes such a control as to make the second pump 7 suck when the first pump 1 discharges and make the second pump discharge when the first pump sucks. Each of the two piezo-pumps is one integrated pump unit having two chambers and two valves. The one piezo-pump has a set of two valves and provided with the first pump chamber above a bimorph and the second pump chamber below the bimorph.