| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-layer film excellent in pinhole resistance and moldability in a field in which it is used in a packaging material for a ceramic chip condenser by a hydrostatic press method. SOLUTION: In the multi-layer film, (A) a layer of a soft polyolefin of a homopolymer of anα-olefin selected from ethylene and propylene or an ethylene- propylene copolymer, a layer of soft polyolefin of a copolymer of ethylene and an acrylate or a methacrylate, or a copolymer selected from partially ionically crosslinked products of them, or a mixture of soft polyolefins, (B) a layer of a polyamide, and (C) a layer of an ethylene-vinyl alcohol copolymer, are laminated in the combination of A and B, or A, B, and C to be used in the packaging material for the ceramic chip condenser.
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