3-D lead inspection

摘要

A semiconductor lead inspection device includes a camera and an illumination source for backlighting the leads of the semiconductor device to form an image in the camera. The camera and the illumination device are arranged on optical paths which alternatively pass through or are reflected by a beamsplitter. A surface is illuminated to backlight the leads and a light deflecting device is arranged for deflecting the backlit image of the semiconductor leads to form an image in the camera.