| 发明名称 |
Method and apparatus of connection to an electrical film device |
| 摘要 |
A method and apparatus for connection of a conductor to a thick film pad is disclosed. Pressure and frictional force are combined to produce a reliable metallurgical bond between the conductor and the thick film pad.
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| 申请公布号 |
US6530776(B1) |
申请公布日期 |
2003.03.11 |
| 申请号 |
US20010972166 |
申请日期 |
2001.10.09 |
| 申请人 |
HUSKY INJECTION MOLDING SYSTEMS, LTD. |
发明人 |
PILAVDZIC JIM;BOOTH ANDREW |
| 分类号 |
B29C45/27;H05B3/46;(IPC1-7):B29C45/20 |
主分类号 |
B29C45/27 |
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