发明名称 Method for etching organic film, method for fabricating semiconductor device and pattern formation method
摘要 An organic film is etched by using plasma generated from an etching gas containing a first gas including a straight chain saturated hydrocarbon and a second gas including a nitrogen component.
申请公布号 US6531402(B2) 申请公布日期 2003.03.11
申请号 US20010798912 申请日期 2001.03.06
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 NAKAGAWA HIDEO
分类号 G03F7/40;H01L21/302;H01L21/3065;H01L21/311;H01L21/3213;H01L21/768;H01L23/522;(IPC1-7):H01L21/302;H01L21/461 主分类号 G03F7/40
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