| 摘要 |
An apparatus substitute is carried and installed in a clean room prior to installation of a semiconductor manufacturing apparatus. The apparatus substitute is composed of separate assembling boxes and is provided with tentative utility connection parts having the same specifications with respect to utility connection parts of the semiconductor manufacturing apparatus. Each of the utility connection parts is temporarily connected to one of a utility line via respective joint pipes. In the utility connection works or temporary connection, an apparatus installation position can be adjusted; a position or a size of a support plate of a floor can be corrected; a route of a utility line or a position can be corrected; or an inspection with respect to each utility line can be performed. After the completion of the inspection of the temporary connection, the utility lines are disconnected from the respective utility connection parts, and the apparatus substitute is divided into the individual boxes and removed from the clean room.
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