发明名称 |
Surface micromachining using a thick release process |
摘要 |
A hybrid process combines a thin-film surface micromachining process such as by sputtering, evaporation or chemical vapor deposition with a thick-film surface micromachining and release process such as dry-film lamination. Such combination results in thin film micro-structures with all the benefits of surface micromachining without the typical problems of stiction and limited range of motion.
|
申请公布号 |
US6531332(B1) |
申请公布日期 |
2003.03.11 |
申请号 |
US20010756860 |
申请日期 |
2001.01.10 |
申请人 |
PARVENU, INC. |
发明人 |
SHKEL ANDREI M;LITTLE MICHAEL J |
分类号 |
B81B3/00;B81C1/00;(IPC1-7):H01L21/00;H01L21/76;H01L21/476 |
主分类号 |
B81B3/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|