| 摘要 |
A Ball Grid Array IC Socket connection with solder ball is characterized in that the conductive plate is formed from bendable, flexible conductive thin plate surrounded to form slotted cylindrical tube for the insertion and clipping of IC pins. The slotted cylindrical tube is in the form of square shape, wherein the size of the tube diameter can tightly clip the ball wall of a solder ball, such that the tube opening mounted with the solder ball provides a tight connection. On the other end of the slotted cylindrical tube, remote from the end inserted with IC pins, at a position about half the height of the solder ball, an arc-shaped slit is provided so that a blocking plate is joined to the wall of the tube, and the blocking plate touches the top portion of the solder ball.
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