发明名称 Method of making a semiconductor device with a low permittivity region
摘要 A method of making a semiconductor device (10) having a low permittivity region (24) includes forming a first layer (30/42) over a surface of a trench (20), and etching through an opening (70) in the first layer that is smaller than a width (W2) of the trench to remove a first material (38) from the trench. A second material (44) is deposited to plug the opening to seal an air pocket (40) in the trench. The low permittivity region features air pockets with a high volume because the small size of the opening allows the second material to plug the trench without accumulating significantly in the trench.
申请公布号 US6531376(B1) 申请公布日期 2003.03.11
申请号 US20020123657 申请日期 2002.04.17
申请人 SEMICONDUCTOR COMPONENTS INDUSTRIES LLC 发明人 CAI WEIZHONG;SUDHAMA CHANDRASEKHARA;WU YUJING;KAMEKONA KEITH
分类号 H01L21/762;H01L21/764;(IPC1-7):H01L21/76 主分类号 H01L21/762
代理机构 代理人
主权项
地址