WAFER EXPOSURE APPARATUS

摘要

PURPOSE: A wafer exposure apparatus is provided to improve the flatness of a wafer by locating a vacuum guide at an edge portion of a vacuum chuck. CONSTITUTION: A wafer(340) is supported by a plurality of support pins(320) of a surface of a vacuum chuck(300) when the wafer(340) is loaded on a vacuum chuck(300). The wafer(340) is absorbed on the support pins(320) by a vacuum pressure of a vacuum hole and a vacuum guide(310) formed on the surface of the vacuum chuck(300). The wafer(300) is protected from contaminants of the surface of the vacuum chuck(300) since the wafer(340) is absorbed on the support pins(320) instead of the surface of the vacuum chuck(300). A diameter of the vacuum guide(310) is smaller than the diameter of the wafer(340). The vacuum guide(310) is located at an edge portion of the vacuum chuck(300).