SEMICONDUCTOR FABRICATION APPARATUS

摘要

PURPOSE: A semiconductor fabrication apparatus is provided to prevent an adhesion of contaminants on an inner wall of a door by using an anti-electrostatic material when the door of a chamber is opened. CONSTITUTION: A door(100) of a process chamber is opened when wafers are transferred from a wafer cassette to the process chamber. The door(100) of the chamber is closed when a fabrication process is performed. A partition(110) is installed on an inner side of the door(100). The partition(110) is formed with an anti-electrostatic material. In addition, the partition(110) is formed with a transparent material. The partition(110) is use for covering a part of the door(100) or an exposed region of the door(100). The partition(110) can be formed with vinyl.