| 摘要 |
PURPOSE: An electrode apparatus for plating a lead frame is provided to improve a plating effect by contacting closely a lead frame with an electrode. CONSTITUTION: An upper frame(14) is vertically shifted along a guide bar(12). A stopper(16) is formed at a front side of the upper frame(14). An electrode block(20) is combined with one side of a lower portion of the upper frame(14) by using a fixing pin(30). The electrode block(20) is rotated along the fixing pin(30). One end portion of a coil spring is fixed to the lower portion of the upper frame(14). The other end portion of the coil spring is used for supporting the electrode block(20). A projection is formed on an upper surface of the electrode block(20). A stop bolt is combined with a lower portion of the upper frame(14).
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