| 摘要 |
PROBLEM TO BE SOLVED: To provide a closed cooling apparatus excellent in cooling efficiency. SOLUTION: In the cooling apparatus, a heat receiving section 3 of a heat pipe 2 is disposed inside a closed casing accommodating electronic components or electronic devices, and a heat radiating section 4 of the heat pipe 2 is disposed outside the casing. The section 4 of the heat pipe 2 is disposed along the sidewall of the casing, and the section 4 is positioned above the section 3. By this constitution, since the section 3 is disposed inside the casing, the section 3 can be positioned near a high-temperature heat generating body, thereby achieving improvement of heat receiving efficiency and increase in exchange heat quantity of the entire apparatus.
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