发明名称 METHOD FOR FORMING CONDUCTIVE PATTERN OF ELECTRONIC COMPONENT, AND COMMON MODE CHOKE COIL
摘要 PROBLEM TO BE SOLVED: To provide a conductive pattern formation method of electronic components, and to provide a method for creating a resin intaglio plate that is used in the pattern formation method, and to provide a common mode choke coil that is created by using the method. SOLUTION: The method for forming conductive pattern of electronic components comprises a process of creating a resin intaglio plate having irregularities corresponding to a conductive pattern, and a formation process of the conductive pattern 12 that fills conductive paste into the resin intaglio plate and transfers the pattern of conductive paste that is filled in the resin intaglio plate to a ceramic substrate 11. The process of creating the resin intaglio plate comprises a first process 1 for creating a master mold, and a second process 2 for filling the resin in the master mold for curing. In the first process 1 for creating the master mold, embossed patterns corresponding to the conductive pattern are formed. The master mold is created by creating an electroforming mold 30 having embossed patterns that are opposite to those of resist. The resin intaglio plate 40 is created after removal from the master mold.
申请公布号 JP2003068555(A) 申请公布日期 2003.03.07
申请号 JP20010254448 申请日期 2001.08.24
申请人 MINEBEA CO LTD 发明人 TAKAYAMA AKIO;NORIZUKI MASASHI
分类号 B41C1/00;H01F17/00;H01F37/00;H01F41/04;H05K3/12;(IPC1-7):H01F41/04 主分类号 B41C1/00
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