| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly efficient method for cleaning a substrate, by which both a particle contaminant and metal contaminant can be removed in a short time, and the problem of redeposition of contaminants or dimensional change of processed substrate by etching is significantly reduced at cleaning. SOLUTION: The method for cleaning the surface of a substrate includes at least the following steps (1) and (2), where the step (1) is carried out after the step (2). The step (1) is a cleaning step of cleaning the surface of the substrate with an alkaline cleaning agent, the step (2) is a step of cleaning which uses a cleaning agent, containing hydrofluoric acid in a content C (wt.%) of 0.3-3 wt.% with a cleaning time t of 45 seconds or less, and C and t satisfy the relation 0.25<=tC<1.29> <=5.
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