| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow soldering device that can uniformly heat a substrate with a mounted electronic part and make the distribution of temperature of the electronic part to be uniform. SOLUTION: This reflow soldering device is provided with a heating means 33 for heating a gas, a fan 29 for sucking the heated gas and blowing out it to the outer periphery, a fan case 28 that changes the direction of the hot air fed from the fan 29 to direct it to a substrate 1 and discharges it to uniform the distribution of its velocity, and a pressure equalizing chamber 26 provided with a blow-out plate 25 having a plurality of nozzles 10 to which the hot air discharged from the fan case 28 enters and from which the hot air is uniformly blown out to a surface opposite to the substrate 1. The fan 29, fan case 28, and pressure equalizing chamber 26 are arranged almost axially, and the substrate 1 is uniformly heated by a vertical compression blow-out method. |
