发明名称 METHOD FOR JOINING PIEZOELECTRIC DEVICE AND PIEZOELECTRIC VIBRATION CHIP, MOBILE PHONE EMPLOYING THE PIEZOELECTRIC DEVICE AND ELECTRONIC DEVICE EMPLOYING THE PIEZOELECTRIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a piezoelectric device that can facilitate positioning when a very small piezoelectric vibration chip is fixed in a package and achieve sufficient joining strength of the piezoelectric vibration chip while preventing electrodes from being short-circuited and to provide a mobile phone and an electronic device employing the piezoelectric device. SOLUTION: The piezoelectric device is provided with a rectangular package 36 that fixes a tuning fork type piezoelectric vibration chip in cantilever fashion and a cover 39 fixed to the package, and is further provided with two electrodes 31, 31 separately placed in the width direction of the package, short-circuit preventing projections 55, 55 that prevent conductive adhesive beads 43, 43 which are applied to the two electrodes 31, 31 to electrically connect and fix the base of the piezoelectric vibration chip from short-circuiting the two electrodes, and an engagement recessed part 58 placed at the end of the base of the piezoelectric vibration chip and engaged with the short-circuit preventing projections.
申请公布号 JP2003069368(A) 申请公布日期 2003.03.07
申请号 JP20010252026 申请日期 2001.08.22
申请人 SEIKO EPSON CORP 发明人 ENDO HIDEO;KATO HIDEAKI
分类号 H03B5/32;H03H3/02;H03H9/02;H03H9/10;H03H9/19;(IPC1-7):H03H9/10 主分类号 H03B5/32
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