| 摘要 |
PROBLEM TO BE SOLVED: To enable a semiconductor device capable of coping with a high speed operation and high-level functions to be reduced in size and weight and improved in electrical properties. SOLUTION: A semiconductor device is equipped with a first semiconductor device 22 and a second semiconductor device 23, solder balls 26, and a board 24 connecting the semiconductor elements 22 and 23 and the solder balls 26. Metal layers 37 and 38 are formed on the surfaces of the semiconductor devices 22 and 23, and power supply pads 33 inside the electrode pads of the semiconductor devices 22 and 23 are electrically connected to the metal layers 37 and 38 respectively.
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