发明名称 MULTILAYER BOARD MANUFACTURING EQUIPMENT
摘要 <p>PROBLEM TO BE SOLVED: To prevent entanglement of a copper foil or the like when placing a copper foil on a placement stand. SOLUTION: A claw section 12 of a holding section 8a for holding a copper foil is provided with an attachment 15a extended in a direction going away from a holding section 8d, and a claw section 12 of the holding section 8d is provided with an attachment 15d extended in a direction going away from the holding section 8a. In like manner, claw sections 12 of holding sections 9a and 9d for holding a transfer target object are provided with attachments 16a and 16d respectively. The placement stand 2 is formed with cutouts 18a-18d, 19a-19d, 20a, 20d, 21a, and 21d in correspondence with the claw sections 12 and attachments 15a, 15d, 16a, and 16d provided in the claws 12.</p>
申请公布号 JP2003069189(A) 申请公布日期 2003.03.07
申请号 JP20010257106 申请日期 2001.08.28
申请人 SHINKO ELECTRIC CO LTD 发明人 MAEHARA MITSUO
分类号 B32B15/08;B32B37/16;H05K3/00;(IPC1-7):H05K3/00;B32B31/04 主分类号 B32B15/08
代理机构 代理人
主权项
地址