发明名称 SIDEWALL-REMOVING LIQUID
摘要 PROBLEM TO BE SOLVED: To provide a removing liquid, capable of removing sidewall at a low temperature and in a short time, without corroding a metal wiring material or an interlayer material, etc. SOLUTION: The sidewall-removing liquid, containing a fluorine compound, certain types of amino alcohols, an organic solvent and water having a pH of 9-11, can remove sidewall at a low temperature and in a short time, without corroding the metal wiring material or the interlayer material.
申请公布号 JP2003068699(A) 申请公布日期 2003.03.07
申请号 JP20010252481 申请日期 2001.08.23
申请人 SHOWA DENKO KK 发明人 SHIMIZU KOJI;SUGIYAMA TSUTOMU;MIYAHARA KUNIAKI
分类号 C09D9/00;H01L21/302;H01L21/306;H01L21/3065;H01L21/3213;H01L21/768;(IPC1-7):H01L21/306;H01L21/321 主分类号 C09D9/00
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