METHOD AND SYSTEM FOR FABRICATING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method and a system in which the influence of particle is reduced by suppressing generation of particles sticking to a semiconductor substrate or suppressing the number of those particles when particles are generation a plurality of processes of a plurality of consecutive steps using the plasma. SOLUTION: In a sequence where processes from a first through a fourth are performed retaining a semiconductor substrate 3 in the chamber 5, the magnitude of the RF power is selected from P1-P4 according to each process treatment and the process treatments from the first to the fourth processes are performed in consecutive steps of 21A-21D.