发明名称 METHOD FOR FABRICATING CONDUCTIVE PATTERN
摘要 PROBLEM TO BE SOLVED: To provide a method for appropriately controlling an electric resistance value by preparing a conductive paste having good printing characteristics in fabrication of a conductive circuit pattern or shield pattern by a printing method. SOLUTION: Using a conductive paste comprising a hardenable resin, a conductive filler, and a solvent, a conductive pattern is printed on an insulation substrate. By applying centrifugal force to the printed matter, the conductive filler in the pattern-printed conductive paste is unevenly distributed toward the insulation substrate or in the opposite direction, and then the conductive paste is hardened to fabricate a conductive pattern.
申请公布号 JP2003069191(A) 申请公布日期 2003.03.07
申请号 JP20010250708 申请日期 2001.08.21
申请人 SUMITOMO RUBBER IND LTD 发明人 OCHI ATSUSHI;KIMURA AKITAKA
分类号 H05K3/12;(IPC1-7):H05K3/12 主分类号 H05K3/12
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