SEMICONDUCTOR MOUNTING METHOD AND SEMICONDUCTOR MOUNTING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor mounting method which can mount a semiconductor device suppressing deviating at thermocompression bonding and have a fine electrode terminal of a connecting pitch to the substrate and to provide the semiconductor device. SOLUTION: The substrate 1 is moved to a thermocompression bonding position just under a heating means 18 by a moving means 22 which fixes and holds the substrate 1 and the substrate 1 which was moved to the thermocompression bonding position by the moving means 22 is adsorbed and fixed by a fixing portion 20 arranged right under the heating means 18. After this, while the heating means 18 thermocompression-bonds the semiconductor device 4, a position deviation of the substrate 1 in the thermocompression bonding position due to thermal expansion at the thermocompression bonding time can be prevented by releasing a fixing state of the substrate 1 by the moving means 22.