| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a manufacturing method for a circuit board resin molding device having high-strength in a simple process, and a circuit board resin molding device having high-strength. SOLUTION: In this method for manufacturing a circuit board resin molding device, the front face of the circuit board, whose back face is coated with a hardenable resin, is coated with a hardenable resin by in-molding method to seal the circuit board, and the resin is hardened to obtain the circuit board resin molding device.</p> |
