| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for obtaining a flat IC tag label. SOLUTION: A base material film is provided with a connecting terminal with the IC chip and a surface antenna circuit on its surface and a conductive circuit or a back surface antenna circuit on its back surface, and release paper is stacked to the back surface of the base material film via an adhesive layer, thus formed into a sticking/releasing processed antenna sheet. After applying the adhesive to an IC chip mounting position of the antenna sheet, the IC chip is mounted thereon and electrically connected to the connecting terminal by flip chip bonding. Then, a heating crimp device or an ultrasonic crimp device is disposed on the IC chip, the IC chip is pushed against the base material film, and at the same time the base material film and the adhesive layer are locally molded into a recess shape by heat. The paper is stacked on the antenna sheet having the IC chip via the adhesive layer.</p> |
