WIRING SUBSTRATE WITH PIN AND ELECTRONIC DEVICE USING IT

摘要

PROBLEM TO BE SOLVED: To provide a wiring substrate having pins, and an electronic device which can normally connect loaded electronic parts to an outside electric circuit with a lead pin not easily detached. SOLUTION: The wiring substrate with pins is provided with a pad 2a with pins consisting of a conductor layer connected electrically to a wiring conductor 2 at a lower face of an organic insulating substrate 1 having the wiring conductor 2 and stands the lead pin 3 in approximately columnar shape to the pad 2b with pins through a solder 9. The conductor layer to form the pad 2b with pin tilts at an angleθof 45 to 60 deg. of its side face to its bottom face.