| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that when connection pads of a wiring board are connected to terminal pads of an external circuit board through conductor bumps, an electric short circuit between connection pads occurs due to a solder bridge because of complicated curvature of the whole wiring board and the high densities of the connection pads. SOLUTION: The wiring board 6 is formed by forming a number of connection pads 3 on a main surface of an insulating base body 1 and characterized in that the connection pads 3 are connected to an external electric circuit board 8 through the conductor bumps 7, a support part 4 which abuts against the external circuit board 8 to prevent the conductor bumps 7 from projecting from the connection pads 3 is provided in a frame shape around the area on the main surface of the insulating base body 1 where the connection pads 3 are formed, and cut parts 5 are formed at at least two places of the support part 4. An electric short circuit between connection pads 3 of the wiring substrate 6 due to a solder bridge can be prevented and bonding assisting agent such as flux used to connect the connection pads 3 by the conductor bumps 7 can effectively be washed.
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