| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method, capable of preventing the splashing of a processing liquid from reaching the surface of a substrate highly reliably, without increasing the running cost. SOLUTION: This substrate processing apparatus is provided with a spin chuck for rotating a wafer W, while holding it almost vertically, a center axis nozzle 3 for supplying a processing liquid at the center of the rear surface of the wafer W, a shutter plate 4 rotating in a state of facing the top surface of the wafer W, and an inert gas supply nozzle 7 for supplying an inert gas onto the top surface of the wafer W. A rotary blade is provided inside the plate 4, to form an air flow 50 outwardly from the circumferential part of the wafer W as the plate 4 rotates. Since the faster the plate 4 rotates, the more the amount of the air flow 50 increases the splashing of the processing liquid can be prevented surely from reaching the center region of the wafer W.
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