| 摘要 |
PROBLEM TO BE SOLVED: To improve the heat radiation efficiency of a laser light source and to make a miniaturized and low-cost photodetector element, in an optical head device in which the laser light source and the photodetector element are loaded on a wiring substrate. SOLUTION: A frame body 9 for the positioning of parts are loaded on a surface 4a of the wiring substrate 4 of an optical head device 1. Positioning parts 98 and 97 for positioning a photodetector element substrate 7 on which the laser light source 6 and the photodetector element 71 are made are formed on the frame body 9. In the positioned state by these, the laser light source 6 and the photodetector element substrate 7 are loaded in different positions on the wiring substrate. Because the laser light source 6 is directly brought into contact with the wiring substrate 4, the radiation efficiency for the heat generated there can be thereby increased. Because the photodetector element substrate 7 does not need the space for loading the laser light source 6, the miniaturization can be achieved, and the parts cost thereof can be reduced.
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