| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent a circuit for a power source or a ground from voltage dropping on a multilayer interconnection board. SOLUTION: The multilayer interconnection board comprises a core board 5 having connecting lands 4 extended from a through conductor passing through an insulating base 2 and a though conductor 3 to a surface of an insulating base 1, and a multilayer wiring section having a plurality of insulating layers 7 and a plurality of wiring conductor layers 8 laminated on a surface of the core board 5 on the insulating base 2. The layer 8 is formed at a site dispose directly above the land 4 in a mesh-like state, and a mesh opening area ratio of the site formed in the mesh-like state is 70% or more. An electromagnetic bond of the land 4 to the layer 7 becomes small. Occurrence of inconsistency of characteristic impedances of the lands 4 can be prevented. Increases in resistance values and impedance values of the layer 8 can be prevented.</p> |
