| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that thermal breakdown of an optical semiconductor element is generated because the heat generated when the optical semiconductor element cannot be radiated effectively to the external side. SOLUTION: This package for accommodating the optical semiconductor element comprises a base material 1, a frame 2 consisting of an iron - cobalt alloy or iron - nickel alloy having a through-hole 2a at the side thereof and a cutout portion 2b, a fixed member 6 coupled with an optical fiber member 8, a ceramic terminal 9 where a wiring layer is formed to a ceramic insulator 10, and a lid member 3. The base material 1 is composed of silicon carbide and copper, and has a three-layer structure wherein an upper layer 1b and a lower layer 1c consisting of silicon carbide of 25 to 55 wt.% and copper of 45 to 75 wt.% are allocated to the upper and lower surfaces of an intermediate layer 1c consisting of silicon carbide of 65 to 80 wt.% and copper of 20 to 35 wt.%. |
