| 摘要 |
PROBLEM TO BE SOLVED: To improve badness of adhesive properties of copper plating so as to lighten an intermediate layer circuit of a multilayer printed wiring board by replacing an aluminum instead of a copper. SOLUTION: A method for through-hole plating comprises a step of using electroless nickel plating as a substrate of electric copper plating. The method further preferably comprises the steps of substituting the nickel on a surface of the aluminum for a nickel salt having strong acid (pH of 1 or less), then electroless nickel plating. The method also comprises the steps of removing an oxide film on the surface of the aluminum, and then substituting the nickel. |
