| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that reliability of connecting an electric circuit formed via a filled via is lowered in a method for manufacturing a board for a semiconductor. SOLUTION: The method for manufacturing the board for the semiconductor device comprises the steps of forming a diameter of a bottom of an opening of the filled via in a shape for largely reducing as compared with a diameter of the opening in a side cross section of a filled via hole, and disposing the opening of the field via within a predetermined accuracy. Thus, a minimum limit connecting area necessary to connected upper and lower wiring layers via the filled via is sufficiently assured. The high reliability can be assured. Since the bottom of the opening of the via 5 is narrowed, the shape for easily filling a plating copper in the via hole is obtained. A thickness of the insulating resin layer is thinly formed, and a high density wiring pattern can be formed by an effect of thinning the conductor layer 8 by plating. |
