| 摘要 |
PROBLEM TO BE SOLVED: To provide a mask for filling a resin which can manufacture a multilayer printed wiring board having an interlayer resin insulating layer including a uniform thickness since a resin filling material layer having a flat surface layer can be formed by using when the filling material is filled in the through hole in the manufacture of the multilayer printed wiring board and which can manufacture a multilayer printed wiring board in which a via hole is not formed directly above a through-hole. SOLUTION: The mask 120 for filling the resin is used when the resin filling material is filled in the through-hole formed in the manufacture of the multilayer printed wiring board. The mask 120 comprises the opening formed at the part corresponding to the through-hole, and at least one auxiliary opening formed to be the same as the area of the opening or larger than the area of the opening. |
