| 摘要 |
PROBLEM TO BE SOLVED: To provide an LSI package capable of preventing a disturbance of an electromagnetic wave to the other generated from the LSI package itself, in which an abrupt acceleration, high density, multiple-pins are particularly advanced, by the LSI package itself in a structure of the LSI package mounted on a printed circuit board for an electronic equipment. SOLUTION: The LSI package comprises a heat spreader for thermally bonding a semiconductor chip mounted on a carrier having a ground surface. The package further comprises a radiation shielding means for preventing the electromagnetic wave from being radiated from a semiconductor chip and the heat spreader, and a connecting means for connecting the shielding means to the ground surface of the carrier and further connecting to a ground layer of a printed circuit board. |
