发明名称 ELECTRONIC CIRCUIT PACKAGE WITH HEAT SINK AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To realize a simpler method for allowing excess thermally conductive grease used for fixing a heat sink to swell out without causing any problem and for removing the grease easily without contaminating the hand at the time of inspection or repair. SOLUTION: The electronic circuit package comprises a printed board 11 mounting nine integrated circuits 111, three capacitors 113 and connection terminals 112, a thin film sheet 13 for wrapping the printed board 11 while sealing the entirety hermetically except the part of the connection terminals 112, thermally conductive grease 14 (light black part) applied onto the thin film sheet 13 on the surface of the nine integrated circuits 111 at a specified thickness, and a heat sink 12 fixed thereon. The package can be protected against bad environment because the printed board is wrapped entirely with the thin film sheet.
申请公布号 JP2003069263(A) 申请公布日期 2003.03.07
申请号 JP20010257869 申请日期 2001.08.28
申请人 NEC SAITAMA LTD 发明人 KOMAKI EISUKE
分类号 H05K3/28;H01L21/56;H01L23/36;H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K3/28
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