| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment, with which the temperature can be elevated/lowered at high speed, while uniformly heating a workpiece to be treated such as a semiconductor wafer in a furnace, when high-frequency induction heating is applied thereto, and to provide a production method for semiconductor device to use such a device. SOLUTION: In the heat treatment apparatus to use a high-frequency induction heating system as a heating source for the workpiece, a dummy object to be treated, with which induction heating is more easily applied than the workpiece to be treated, is used as an auxiliary heat source for directly heating the workpiece and uniformity of heat treatment temperature is secured.
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