| 摘要 |
PROBLEM TO BE SOLVED: To provide an attachment method for an IC chip improving the attachment position to an object and the attachment accuracy and to provide a packaging material and a packaging container fitted with the IC chip manufactured by the attachment method. SOLUTION: A recess part 12 is formed in an attachment object body 11, a non-contact type IC chip 13 capable of reading or reading/writing data by a non-contact type is attached to the recess part 12, and a film 14 is stacked thereon. Means for forming the recess part 12 is not specified particularly and, when the attachment object body 11 is a plane substrate sheet, for example, the substrate is preferably embossed. |
