| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that, in mounting a chip on a ceramic board by a mount arm, warp in the board retards the mounting operation and makes it difficult to improve work indexes. SOLUTION: In a mount process, a chip 3 is mounted a working points (points of mount) P formed on a working face 2, or the upper face of a board 1, such as a ceramic board, by a mount arm 4. In this process, the coordinate point of the height of a working point P against which the mount arm 4 is abutted is detected at each time of arm approaching operation, wherein the mount arm 4 is decelerated to low speed and brought closer from a distant point K to a working point. This coordinate point is estimated as the coordinate point of the next working point P at which the mount arm 4 performs arm approaching operation. The position of a distant point K on the trajectory on which the mount arm 4 should perform the next arm approaching operation is set at a height at a constant distance L from the estimated coordinate point. |
