MULTILAYERED CHIP PACKAGING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide the packing structure of multilayered chips where a plurality of semiconductor chips are arranged adjacent to each other so as to be formed into the planar shapes of a plurality of laminated semiconductor chips. SOLUTION: A multilayered chip packaging structure is equipped with a board 402 provided with front and rear surfaces; a plurality of semiconductor chips 406 and 408 which are contiguously laminated into a plurality of laminated semiconductor chip sets; a plurality of wires 410a and 410b which connect the semiconductor chips to each other and to the board; a plurality of supporting members 420 which separate two adjacent semiconductor chips; a plurality of adhesive layers 404 which bond the supporting members, the semiconductor chips and the substrate to one another; and a molding material 414 which encapsulates the front surface of the substrate, the semiconductor chips, the supporting members and the adhesive layers. The size deviation between the semiconductor chips is less than 0.3 mm, and each of the semiconductor chips has respectively a plurality of bonding pads.