| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for discrete element the component cost of which can be reduced and, in addition, the total thickness of which can be reduced to the utmost. SOLUTION: This package is constituted in a structure in which no die pad exists under a discrete element 11. This package is manufactured by preparing a lead frame connected with a connecting terminal section 12 by its lead section and sticking a resin burr preventing heat-resistant tape to the rear surface of the lead frame. Then the discrete element 11 having a metallized rear surface is mounted on the lead frame from the surface side of the tape, and an electrode provided on the top face of the element 11 is wire-bonded to the terminal section 12 of the lead frame. In addition, the surrounding area of the discrete element 11 including a wire 13 and the terminal section 12 is collectively sealed with a molding resin 14. After molding, the heat-resistant tape is exchanged with a dicing tape and the formed body is diced into individual packages. |
