| 摘要 |
PROBLEM TO BE SOLVED: To improve impedance characteristic between an I/O buffer and a solder ball, and reduce crosstalk noise between the I/O buffer and an internal cell. SOLUTION: An I/O buffer unit 102 is provided with signal solder balls 115 for signal transmission to the outside, the I/O buffers 101 in which signal terminals 112 are connected with the signal solder balls 115, I/O buffer ground wiring 107 connected with a GND terminal 110 of the I/O buffer 101, and I/O buffer power source wiring 108 connected with a power source terminal 111 of the I/O buffer 101. The I/O buffer unit 102 is arranged on a chip. |
