| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for processing the edge of a wafer, capable of solving a problem of chipping on the sharp edge of the wafer like a thinned wafer. SOLUTION: The method of processing the edge of the wafer comprises the steps of: generating a glow discharge along the inner surface of a cylinder which forms an open air-pressure discharge space; introducing a process gas into the discharge space; coating the wafer with a protective material except its edge; and processing the edge of the wafer coated with the protective material by passing it through the discharge space in the cylinder.
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