MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To improve foreign matter removing performance in a cleaning processing. SOLUTION: In cleaning a wafer 2, while moving a brush 7 from the center toward outer periphery of the wafer 2, discharge flow rates X1, X2 of a cleaning liquid to be made to flow are adjusted, so that distances d1, d2 between the brush 7 and the wafer 2 become constant.