METHOD OF MANUFACTURING FILM CARRIER TAPE FOR MOUNTING ELECTRONIC PART

摘要

PROBLEM TO BE SOLVED: To manufacture a film carrier tape for mounting electronic parts with less deformation, to especially improve carrier property, to reduce damage and dislocation due to tape deformation and to improve the mounting property of electronic parts. SOLUTION: The manufacturing method of the film carrier tape for mounting electronic parts is obtained through a process where a wiring pattern constituted of conductive metal is formed at least on one face of a film and a process where the terminal part of the wiring pattern is left and solder resist is applied/ cured. Warp deformation due to the bend of the tape in the width direction of the film carrier tape is corrected before the electronic parts are mounted on the terminal part exposed from the solder resist of the film carrier tape for mounting electronic parts, and curl-like deformation due to the bend of the tape in the longitudinal direction of the film carrier tape is corrected.